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 MC14572UB Hex Gate
The MC14572UB hex functional gate is constructed with MOS P-channel and N-channel enhancement mode devices in a single monolithic structure. These complementary MOS logic gates find primary use where low power dissipation and/or high noise immunity is desired. The chip contains four inverters, one NOR gate and one NAND gate.
Features
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16 MC14572UBCP AWLYYWWG 1
* * * * * * * * *
Diode Protection on All Inputs Single Supply Operation Supply Voltage Range = 3.0 Vdc to 18 Vdc NOR Input Pin Adjacent to VSS Pin to Simplify Use As An Inverter NAND Input Pin Adjacent to VDD Pin to Simplify Use As An Inverter NOR Output Pin Adjacent to Inverter Input Pin For OR Application NAND Output Pin Adjacent to Inverter Input Pin For AND Application Capable of Driving Two Low-Power TTL Loads or One Low-Power Schottky TTL Load over the Rated Temperature Range Pb-Free Packages are Available*
PDIP-16 P SUFFIX CASE 648 1 SOIC-16 D SUFFIX CASE 751B 1
16 14572UBG AWLYWW 1
MAXIMUM RATINGS (Voltages Referenced to VSS)
Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 1) Ambient Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Value -0.5 to +18.0 -0.5 to VDD + 0.5 10 500 -55 to +125 -65 to +150 260 Unit V V mA mW C C C A WL, L YY, Y WW, W G 1
SOEIAJ-16 F SUFFIX CASE 966
16 MC14572UB ALYWG 1
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
ORDERING INFORMATION
Device MC14572UBCP MC14572UBCPG MC14572UBD MC14572UBDG MC14572UBDR2 MC14572UBDR2G MC14572UBF Package PDIP-16 PDIP-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOEIAJ-16 Shipping 25 Units / Rail 25 Units / Rail 48 Units / Rail 48 Units / Rail 2500/Tape & Reel 2500/Tape & Reel 50 Units / Rail
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2006
1
June, 2006 - Rev. 6
Publication Order Number: MC14572UB/D
MC14572UB
PIN ASSIGNMENT
OUTA INA OUTB INB OUTC IN 1C IN 2C VSS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD IN 2F IN 1F OUTF INE OUTE IND OUTD 4 3 2
LOGIC DIAGRAM
1
6 7
5
10
9
12
11
14 15 VDD = PIN 16 VSS = PIN 8
13
CIRCUIT SCHEMATIC
VDD VDD VDD
2
1
7
13 14
6 VSS
5
VSS
15
VSS
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MC14572UB
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
- 55_C VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 VIH 5.0 10 15 IOH Source 5.0 5.0 10 15 IOL 5.0 10 15 15 - 5.0 10 15 5.0 10 15 - 1.2 - 0.25 - 0.62 - 1.8 0.64 1.6 4.2 - - - - - - - - - - - - 0.1 - 0.25 0.5 1.0 - 1.0 - 0.2 - 0.5 - 1.5 0.51 1.3 3.4 - - - - - - 1.7 - 0.36 - 0.9 - 3.5 0.88 2.25 8.8 0.00001 5.0 0.0005 0.0010 0.0015 - - - - - - - 0.1 7.5 0.25 0.5 1.0 - 0.7 - 0.14 - 0.35 - 1.1 0.36 0.9 2.4 - - - - - - - - - - - - 1.0 - 7.5 15 30 mAdc 4.0 8.0 12.5 - - - 4.0 8.0 12.5 2.75 5.50 8.25 - - - 4.0 8.0 12.5 - - - mAdc 25_C 125_C Characteristic Symbol VOL Min - - - 4.95 9.95 14.95 - - - Max Min - - - 4.95 9.95 14.95 - - - Typ (Note 2) 0 0 0 5.0 10 15 2.25 4.50 6.75 Max Min - - - 4.95 9.95 14.95 - - - Max Unit Vdc Output Voltage Vin = VDD or 0 Vin = 0 or VDD "0" Level 0.05 0.05 0.05 - - - 1.0 2.0 2.5 0.05 0.05 0.05 - - - 1.0 2.0 2.5 0.05 0.05 0.05 - - - 1.0 2.0 2.5 Vdc "1" Level VOH Vdc Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) "1" Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Input Current Input Capacitance (Vin = 0) Quiescent Current (Per Package) VIL Vdc Sink Iin Cin IDD mAdc pF mAdc Total Supply Current (Notes 3, 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT IT = (1.89 mA/kHz) f + IDD IT = (3.80 mA/kHz) f + IDD IT = (5.68 mA/kHz) f + IDD mAdc 2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.006.
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MC14572UB
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SWITCHING CHARACTERISTICS (Type 5) (CL = 50 pF, TA = 25_C)
Characteristic Symbol tTLH VDD 5.0 10 15 5.0 10 15 tPLH, tPHL 5.0 10 15 Min - - - - - - - - - Typ (Note 6) 180 90 65 100 50 40 90 50 40 Max 360 180 130 200 100 80 ns 180 100 80 Unit ns Output Rise Time tTLH = (3.0 ns/pF) CL + 30 ns tTLH = (1.5 ns/pF) CL + 15 ns tTLH = (1.1 ns/pF) CL + 10 ns Output Fall Time tTHL = (1.5 ns/pF) CL + 25 ns tTHL = (0.75 ns/pF) CL + 12.5 ns tTHL = (0.55 ns/pF) CL + 9.5 ns Propagation Delay Time tPLH, tPHL = (1.7 ns/pF) CL + 5 ns tPLH, tPHL = (0.66 ns/pF) CL + 17 ns tPLH, tPHL = (0.5 ns/pF) CL + 15 ns tTHL ns 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. VDD INPUT 2 16 1 8 VSS CL OUTPUT INPUT 7 6 8 VSS VDD 16 OUTPUT PULSE GENERATOR PULSE GENERATOR 5 CL VDD 16 INPUT 15 14 13 8 VSS CL OUTPUT INPUT 90% 50% 10% tPHL OUTPUT 90% 50% 10% tf tr 20 ns 90% 50% 10% tPLH 90% 50% 10% VOH VOL 20 ns VDD VSS PULSE GENERATOR
Figure 1. Switching Time Test Circuits and Waveforms
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MC14572UB
PACKAGE DIMENSIONS
PDIP-16 CASE 648-08 ISSUE T
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.
B
1 8
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
DIM A B C D F G H J K L M S
INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040
MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
SOIC-16 CASE 751B-05 ISSUE J
-A-
16 9
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
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MC14572UB
PACKAGE DIMENSIONS
SOEIAJ-16 CASE 966-01 ISSUE A
16
9
LE Q1 E HE M_ L DETAIL P
1
8
Z D e A VIEW P
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
b 0.13 (0.005)
M
A1 0.10 (0.004)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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6
MC14572UB/D


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